Premium printed circuit board assembly factory? Since beginning, as a printed circuit board (PCB) vendor in Asia, Best Technology is dedicating to be your best partner of advance, high-precision printed circuit boards, such as heavy copper boards, ultra thin PCB, mixed layers, high TG, HDI, high frequency (Rogers, Taconic), impedance controlled board, Metal Core PCB (MCPCB) such as Aluminum PCB, Copper PCB, and Ceramic PCB (conductor Copper, AgPd, Au, etc) and so on. Discover additional details on printed circuit board manufacturers. The white silkscreen layer is applied on top of the soldermask layer. The silkscreen adds letters, numbers, and symbols to the PCB that allow for easier assembly and indicators for humans to better understand the board. We often use silkscreen labels to indicate what the function of each pin or LED. Silkscreen is most commonly white but any ink color can be used. Black, gray, red, and even yellow silkscreen colors are widely available; it is, however, uncommon to see more than one color on a single board.
Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple. Art-of-state Technology: Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc.
In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
PCB or Printed Circuit Board is the traditional name for the bare board of which you supply us with the layout data and which you use to mount your components on once we have delivered it to you. A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Find even more details on bstpcb.com.
The main difference between a FR4 board and MCPCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to lab testing a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient. LED PCB always be produced with Aluminum core, but sometimes steel core PCB also be used.